In terms of Rules 65 of Public Procurement Rules, 2026 Grievance Redressal Committee (GRC) is notified for the subject procurement and notification copy is available on the procuring agency’s website and also available on EPADS v2.0 as well as Authority’s website at (www.ppra.gov.pk).
Pakistan Software Export Board` (Pakistan Software Export Board), Project Director
IFC BUILDING - Pakistan Software Export Board Second Floor
5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
+92-313-228-5032
skashif@pseb.org.pk
The following specific data for the procurement of Goods to be procured shall complement, supplement, or amend the provisions in the Instructions to Bidders (ITB). Whenever there is a conflict, the provisions herein shall prevail over those in ITB.
BDS Clause Number
ITB Number
Amendments of, and Supplements to, Clauses in the Instruction to Bidders
BDS Clause Number 1
ITB Number 1.1
Name of Procuring Agency: Pakistan Software Export Board` (Pakistan Software Export Board)
The subject of procurement is: PROCUREMENT OF SERVICES FOR UPSKILLING TRAINING PROGRAM (USTP) FOR THE PROJECT “NATIONAL SEMICONDUCTOR HUMAN RESOURCE DEVELOPMENT PROGRAM (NSHRDP) PHASE-I”
Expected commencement date: Friday, January 1, 2027
BDS Clause Number 2
ITB Number 2.1
Financial year for the operations of the Procuring Agency: 2026-27
Name and identification number of the Contract: P174105
BDS Clause Number 3
ITB Number 4.6
JV/Consortium or Association Allowed: Yes
Number of JV/Consortium Members: 10
BDS Clause Number 4
ITB Number 7.1
The Bidders may seek clarifications through EPADS v2.0: Clarification Date: Friday, November 20, 2026
Pre-Bid Meeting: Wednesday, November 11, 2026 02:00 PM
Venue: IFC BUILDING - Pakistan Software Export Board Second Floor
5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
Meeting Link: https://zoom.us/j/92085354787?pwd=rau2pHCpKgItShD54tT6Vtpgmc3KTR.1
BDS Clause Number 5
ITB Number 8.1
Any addendum, in case issued, shall be published on Pakistan Software Export Board` (Pakistan Software Export Board) website and on EPADS v2.0.
BDS Clause Number 6
ITB Number9.1
List of documents required along with the bid: No
BDS Clause Number 7
ITB Number 11.1
The qualification criteria to establish the supply / production capability of the bidder.
see Eligibility Criteria
BDS Clause Number 8
ITB Number 7.6
Services and Their related documents:
See section Required Services and Scope of Work
BDS Clause Number 9
ITB Number 13.1 & 13.2
Price schedule will be provided according to the format defined and acquired.
see section price schedule.
BDS Clause Number 10
ITB Number 7.6.2
Specifications:
see section of specifications.
BDS Clause Number 11
ITB Number 13.5
The price shall be Fixed.
BDS Clause Number 12
ITB Number 15.1
Currency of the Bids shall be : PKR
BDS Clause Number 13
ITB Number 16.1
The Bids/Bid Validity period shall be: 180 Days
BDS Clause Number 14
ITB Number 17.1
The amount of Bid Security shall be as defined in Bid Security Section for items and lots given in BDS 6
Instrument of Bid Security Shall be in the Name of : Pakistan Software Export Board`
The Bid Security shall be in the form of: Pay Order, Bank Guarantee, Demand Draft
BDS Clause Number 15
ITB Number 17.3
The Bids security shall be valid for twenty-eight (28) days beyond the expiry of the Bids validity period specified in the bidding documents, for example the bid validity is 180 days so the bid security shall be valid for 180+28 = 208 days.
BDS Clause Number 16
ITB Number 18.1
Alternative Bids to the requirements of the bidding documents will not be permitted.
BDS Clause Number 17
ITB Number 21.1
Bid shall be submitted online on EPADS v2.0 whereas hard copy of the bid security should be submitted to the following;
IFC BUILDING - Pakistan Software Export Board Second Floor 5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
Bids that are not submitted on EPADS v2.0 shall be disqualified.
The deadline for Bids submission is: Monday, November 23, 2026 03:00 PM
BDS Clause Number 18
ITB Number 26.1
The Bids opening shall take place on EPADS v2.0.
Day : Monday
Date: Monday, November 23, 2026
Time : 03:30 PM
BDS Clause Number 19
ITB Number 32.1
Selection technique adopted will be: Quality and Cost Based Selection (QCBS)
see Evaluation Criteria
BDS Clause Number 20
ITB Number 49.1
The Performance guarantee shall: 5.00%.
The Performance Guarantee shall be acceptable in the form of: Pay Order, Bank Guarantee
BDS Clause Number 21
ITB Number 51.1
Arbitrator shall be appointed by mutual consent of the both parties.
BDS Clause Number 22
ITB Number 53.1
Grievence against this procurement shall be submitted online on EPADS v2.0.
All Active Taxpayers shall be eligible to participate in the procurement process, unless expressly excluded or otherwise restricted under the Eligibility Criteria specified by the Procuring Agency.
| Required Registration |
|---|
|
FBR (NTN) FBR (GSTN) |
| Eligibility Criteria | Document |
|---|---|
| Proof of Certificate of Incorporation or Registration or equivalent (applicable on lead and all consortium partners). | Yes |
| Letter of Credit line of PKR 100 million from Bank for the period of one year from proposal submission date /Audited financial statement of at least two financial years out of the last 3 completed financial years. (requirement can be filled by any of the partner individually or as a consortium) | Yes |
| Proof of GST Registration, (if applicable), from the Lead Partner and all consortium partners. | Yes |
| Original affidavit (not older than one month) from lead bidder on Stamp Paper(s) of worth Rs.100 or more that each entity of the consortium is not insolvent, bankrupt and is not blacklisted or debarred by PPRA, Government, Semi-Government, Private, Autonomous body or any other international organization. Must be provided before closing time of the bid submission | Yes |
| Must have an active status on the Active Taxpayers List (ATL) of FBR at the time of bid submission and must remain active until contract completion. Latest ATL status printout/download from the FBR portal evidencing active taxpayer status as of the bid submission date. | Yes |
| A formal consortium agreement not older than one month on Stamp Paper(s) of worth Rs.100 or more outlining roles, responsibilities must be submitted with the proposal. Minimum 3- consortium partners are allowed. | Yes |
| Members of one consortium cannot be part of other consortium participating in this bidding process. | Yes |
| Bidders are required to provide list of centers along with capacity of each lab for accommodating trainees in each batch (maximum 40), the proposed centers should be located in geographical boundaries as defined in Central, North and South Region for each Lot applied for, any non-compliance in this regard shall lead to disqualification. | Yes |
| Undertaking from lead bidder on letter head that all items / services will be delivered within agreed timelines after the issuance of purchase order/Contract Signing. Failing to provide items / services within agreed timelines, a penalty will be levied as mentioned in this document. | Yes |
| Lead partner or one of the consortium partners must have presence in their respective region. | Yes |
Quality and Cost Based Selection (QCBS)
Weightage
| Technical Evaluation % | Financial Evaluation % |
|---|---|
| 80 | 20 |
| Technical Marks | 175 | |
|---|---|---|
| Passing Marks | 123 | |
| Technical Evaluation Criteria | ||
| Firm/Bidder Profile : 01 mark per year (Max. 10 Marks)
Certificate of (Registered age)–Incorporation /
(Form B2)
Registration documents (Lead firm’s age will be
considered) or Registration with relevant authorities (Quantitative)(Doc Required) 10-Years (10) 9-Years (9) 8-Years (8) 7-Years (7) 6-Years (6) 5-Years (5) 4-Years (4) 3-Years (3) 2-Years (2) 1-Year (1) | 10 | |
| Experience of Consortium in Conducting Similar Trainings/ Courses • (Total No. of (40-200) Trainees or Students • 30 days’ duration of each) in the field of semiconductor and IC chip design. • Please fill the Form B3 for the above detail and the below evidence must be attached for scoring • 15 marks for Training related to semiconductor and chip design: (3 Marks for each training) • 15 marks for Course’s related to semiconductor and chip design: (3 Marks for each course (UG & PG level) • Purchase Orders / Completion certificate and/or signed contracts shall be attached as evidence • (Experience of all consortium members consolidated). For Courses (Industry approved course outline is required). (Qualitative)(Doc Required) | 30 | |
| Qualification and Competence of the proposed Team Members–Full Time/Part time/ (Form B4-I & B4-II). Relevant work experience of team lead (One project (chip design project / training)) =1.0 mark) (Maximum 5 marks) Relevant experience of the team deployed on this assignment (training on IC Chip Design and Verification) 3 marks for each team member (Maximum 15 marks). Following is the bifurcation of CV to be provided on Form – B4-I Team composition to be provide on Form B4-II and details to be provided on Form B4-I. a) Education and qualifications in relevant field [1 mark maximum] i. 18 years of Education (1 mark) ii. 16 years of Education (0.5 mark) b) Relevant Work Experience [1 mark maximum] i. Number of similar projects / trainings (0.2 marks for each project / training) c) Relevant Professional Certifications [1-mark maximum] i. 0.5 marks for each certification (Qualitative)(Doc Required) | 20 | |
| Training Methodology The trainings methodology shall include: a. Training Delivery Structure b. Curriculum Integration c. Practical Components d. Assessment and Evaluation e. Soft Skills & Career Support f. Component wise work plan & Timelines (each component carries 05 marks) Detailed Write-up to be provided for each component. (Form B-5-III) (Qualitative)(Doc Required) | 30 | |
| Financials Strength of the Bidder (requirement can be filled by any of the partner individually or as a consortium).
Audited financial statement of at least two financial years out of the last 3 completed financial years (Qualitative)(Doc Required) Average annual Budget of the last 2 years is more than 500 million (20) Average annual Budget of the last 2 years is more than 300 Million (10) Average annual Budget of the last 2 years is more than 100 Million (5) | 20 | |
| Transfer of Knowledge Submitted Training Plan & Manuals Submission of training plan for PSEB’s designated staff (3 marks) Detailed Training Manuals (7 marks) Note: Fully meets 100% All requirements addressed in detail, with a clear, specific and practicable approach. Largely meets 70% Most requirements addressed; minor gaps or generic content. Partially meets 40% Some requirements addressed; significant gaps. Not addressed 0% Requirement not addressed or not demonstrated. (Qualitative)(Doc Required) | 10 | |
| Physical & ICT Infrastructure a. Labs equipment relevant to the nature of training (05 Marks) b. Classroom infrastructure (05 Marks) c. EDA Tools availability (10 Marks) Inventory List, Photographs, Licenses for EDA Tools (Form B5-I) (Qualitative)(Doc Required) | 20 | |
| Industry engagement / support letters Support Letters/MoU/Agreement signed with IC Chip Design/Verification companies working in relevant Industry of the project (02 Marks for each) Support Letters / MOUs / Agreements (Qualitative)(Doc Required) | 10 | |
| Inclusivity • Inclusion of women, minorities, and differently-abled trainees. (2.5 marks) • Participation consortium members from Tier-II or Tier-III cities (2.5 marks) A supporting write-up is required to be furnished with the proposal (Form B5-II) (Qualitative)(Doc Required) | 5 | |
| Presentation / Demonstration of the Proposed Solution Onsite presentation of proposed solutions by participating bidders / consortium Note: Fully meets 100% All requirements addressed in detail, with a clear, specific and practicable approach. Largely meets 70% Most requirements addressed; minor gaps or generic content. Partially meets 40% Some requirements addressed; significant gaps. Not addressed 0% Requirement not addressed or not demonstrated. (Qualitative)(Doc Required) | 20 | |
Lot Title : Lot-I: Southern Region (Sindh & Balochistan)Training Delivery Model
Bid Security : 3390400 PKR
| Position | Delivery Schedule | Quantity |
|---|---|---|
| . | Address: . Schedule: .Quantity: 1/job |
1/job |
| Lot-I: Southern Region (Sindh & Balochistan) | Address: Southern Region (Sindh & Balochistan) Schedule: Within 120 days after signing of contractQuantity: 1/job |
1/job |
Lot Title : Lot-II: Central Region (Punjab)
Bid Security : 3390400 PKR
| Position | Delivery Schedule | Quantity |
|---|---|---|
| Lot-II: Central Region (Punjab) | Address: Lot-II: Central Region (Punjab) Schedule: Within 120-days after signing of contractQuantity: 1/job |
1/job |
| . | Address: . Schedule: .Quantity: 1/job |
1/job |
Lot Title : Lot-III: Northern Region (ICT, KP, AJK & GB)
Bid Security : 3390000 PKR
| Position | Delivery Schedule | Quantity |
|---|---|---|
| Lot-III: Northern Region (ICT, KP, AJK & GB) | Address: Lot-III: Northern Region (ICT, KP, AJK & GB) Schedule: Within 120-days after signing of contractQuantity: 1/job |
1/job |
| . | Address: . Schedule: .Quantity: 1/job |
1/job |
No
Lot Title : Lot-I: Southern Region (Sindh & Balochistan)Training Delivery Model
Position: .
Specifications / Requirements:
.Position: Lot-I: Southern Region (Sindh & Balochistan)
Specifications / Requirements:
To prepare fresh engineering graduates with essential theoretical and practical knowledge that is typically missing from undergraduate curricula, in addition to hands on training fundamentals of chip design and verification methodologies/techniques, making them job-ready for entry into the semiconductor domain. Below is the outline of intended trainings spanned over 04 months and covered in max 500 hours. The consortium is to submit a comprehensive/detailed course details planned to deliver. The respective authority will review the detailed curriculum in line with the below outlines and course objectives and approve or amend, as deemed appropriate.Lot Title : Lot-II: Central Region (Punjab)
Position: Lot-II: Central Region (Punjab)
Specifications / Requirements:
To prepare fresh engineering graduates with essential theoretical and practical knowledge that is typically missing from undergraduate curricula, in addition to hands on training fundamentals of chip design and verification methodologies/techniques, making them job-ready for entry into the semiconductor domain. Below is the outline of intended trainings spanned over 04 months and covered in max 500 hours. The consortium is to submit a comprehensive/detailed course details planned to deliver. The respective authority will review the detailed curriculum in line with the below outlines and course objectives and approve or amend, as deemed appropriate.Position: .
Specifications / Requirements:
.Lot Title : Lot-III: Northern Region (ICT, KP, AJK & GB)
Position: Lot-III: Northern Region (ICT, KP, AJK & GB)
Specifications / Requirements:
To prepare fresh engineering graduates with essential theoretical and practical knowledge that is typically missing from undergraduate curricula, in addition to hands on training fundamentals of chip design and verification methodologies/techniques, making them job-ready for entry into the semiconductor domain. Below is the outline of intended trainings spanned over 04 months and covered in max 500 hours. The consortium is to submit a comprehensive/detailed course details planned to deliver. The respective authority will review the detailed curriculum in line with the below outlines and course objectives and approve or amend, as deemed appropriate.Position: .
Specifications / Requirements:
.Objectives of Procurement
The primary objective of this procurement is to engage capable and experienced academic
institutions, training providers, and technical organizations in the design, development, and
delivery of outcome-driven, structured training programs focused on semiconductor IC chip
design and verification. These programs aim to address the growing demand for skilled
semiconductor professionals in Pakistan and align the local talent pool with international
industry standards. Specifically, this procurement of trainings services seeks to:
3.1. Build a Scalable Semiconductor Talent Pipeline
Launch and institutionalize tiered training programs (Foundation, Specialized, Expert) that
progressively upskill engineering graduates—from basic semiconductor knowledge to
project-ready and expert-level capabilities. This includes integrating industry standard EDA
tools, industry-standard methodologies, and real-world design practices into the training
curriculum.
3.2. Bridge the Skills Gap in IC Design and Verification
Address the critical shortage of hands-on experience among engineering graduates, which has
previously led companies to invest heavily in costly and time-consuming in-house training.
By standardizing and externalizing this process through national training initiatives, the
burden on industry is reduced and new talent can be integrated more efficiently.
3.3. Enhance Industry Readiness and Employability
Develop a workforce that is deployable from day one through hands-on exposure to industry
tools and workflows, collaborative design projects, and domain-specific specialization tracks.
Procurement will support training models that include direct industry engagement,
mentorship, and job placement.
3.4. Promote Inclusive and Decentralized Access to Semiconductor Training
Encourage participation from institutions across geographic regions to democratize access to
specialized training. This will enable a more diverse and inclusive talent pipeline and support
national efforts to build semiconductor clusters beyond traditional urban centers.
3.5. Accelerate Ecosystem Development for Fabless IC Design
By seeding trained professionals at multiple levels of expertise (foundation, specialist,
expert), this initiative aims to create an enabling environment for startups, multinational
R&D centers, and local design houses to scale operations, form seed teams, and undertake
complex design projects locally.
3.6. Enable Outcome-Based Funding Linked to Measurable KPIs
Training providers will be held accountable through clearly defined performance metrics,
including placement rates, project completion, and industry endorsement. This procurement
process will enforce standards and track outputs, ensuring that public investment yields measurable economic and technological outcomes.
3.7. Catalyze Public-Private-Academic Collaboration
Leverage partnerships between academia, government, and the private sector to align curricula, optimize resources (e.g., shared EDA labs), and strengthen Pakistan’s positioning in the global semiconductor value chain.
Through this RFP, NSHRDP seeks committed consortiums with proven experience, and the capacity to deliver USTP program solutions with comprehensive trainings.
The selected training institutions/ partners will be responsible for the design, delivery, monitoring, and evaluation of structured upskilling programs of Level-I (Foundation Course) trainings with enhanced course curriculum on IC Chip Design and Verification training. This program will be executed under Component II of the National Semiconductor Human Resource Development Program (NSHRDP), and aim to bridge the skills gap in Pakistan’s semiconductor ecosystem by preparing engineers for industry-aligned, job-ready roles in chip design and verification.
The programs will be designed to include industry-relevant curricula, hands-on labs, project-based learning, and certification linked to performance. The institutions are expected to ensure high-quality instruction, learning outcomes on international standards, and strong linkages with industry for employment, mentorship, and feedback integration.
The trainings will be conducting simultaneously in the regions, as follows:
Lot-I:Â Â Â Â Southern Region (Sindh & Balochistan)
Lot-II:Â Â Â Central Region (Punjab)
Lot-III:Â Northern Region (ICT, KP, AJK & GB)
Â
A consortium may submit a Proposal for the respective LOT based on its geographical presence in the relevant region.
The Technical Proposal shall clearly state the Lot(s) applied for and, for each Lot, the training centre(s) located within the geographical boundaries of that Lot (Clause 5.6, item 9).
A separate Financial Proposal (Form C3) shall be submitted for each Lot applied for.
Technical and financial evaluation shall be carried out separately for each Lot. Criteria relating to centres, labs and infrastructure shall be assessed against the centres proposed for that Lot.
The Proposal obtaining the highest combined score (out of 100%) in a Lot will be recommended for award of contract for that respective Lot, as per Clause 5.9. A separate contract shall be signed for each Lot.
Â
|
Lot-I |
Lot-II |
Lot-III |
|
350 |
350 |
350 |
Â
The number of trainings mentioned against each station may be changed based on the availability of funds and trainees’ enrollment.
Graduates 2023 onwards, of following disciplines will be eligible to participate in the trainings: BS/M.Phil Electronic Engineering, Electronics, Software Engineering, Computer Engineering, Electrical Engineering or the related disciplines as approved the competent authority.
No single firm or entity shall be eligible to participate independently. Participation will only be permitted through a consortium comprising academia, companies engaged in chip/semiconductor-related business, and established training centers with demonstrated experience in delivering high-tech training programs. Lead partner or one of the consortium partners must have presence in the Region.
To prepare fresh engineering graduates with essential theoretical and practical knowledge that is typically missing from undergraduate curricula, in addition to hands on training fundamentals of chip design and verification methodologies/techniques, making them job-ready for entry into the semiconductor domain. Below is the outline of intended trainings spanned over 04 months and covered in max 500 hours. The consortium is to submit a comprehensive/detailed course details planned to deliver. The respective authority will review the detailed curriculum in line with the below outlines and course objectives and approve or amend, as deemed appropriate.
Â
The bidding consortiums to propose international certifications against the given course outlines preferably free of cost (FoC) or at nominal charges while adding this cost in the BoQ. The procuring agency will do a cost benefit analysis to make an appropriate decision.
Goal: Build core programming and digital design skills.
C/C++ for Hardware Engineers
Basics: syntax, control structures, pointers, arrays, strings
Data structures: linked lists, queues, stacks, hash tables
OOP concepts: inheritance, polymorphism, virtual functions, lambdas
Low-level coding: bitwise operations, memory-mapped I/O simulation
Lab: Cache simulator in C++
Boolean algebra, combinational & sequential logic
Finite State Machines (Use relevant tools, to deliver the module)
Timing concepts: setup/hold, metastability, clock domain crossing
Basic protocols: UART, SPI, I²C
Lab: FSM-based UART controller (behavioral simulation)
Goal: Master synthesizable Verilog RTL coding and learn common interface protocols.
Modules, ports, parameters, generate blocks
Combinational logic (always @(*), blocking assignments)
Sequential logic (always @(posedge clk), non-blocking assignments, resets)
FSM design patterns, avoiding latches
Hierarchical design & parameterization
Tool Flow:
Simulate RTL in tools (Use relevant tools, to deliver the module)
Lint (Use relevant tools, to deliver the module)
Synthesize (Use relevant tools, to deliver the module)
Lab: ALU, FIFO, and a 2-way set associative cache controller
AMBA bus standards: AXI, AHB, APB
Protocol design considerations
Simple DMA engine design
Lab: AXI-lite slave RTL module with APB bridge
Goal: Transition to verification coding and understand ASIC tool flows.
RTL → GDSII overview
Linting & CDC analysis
Synthesis & constraints
Static Timing Analysis
Floor planning & routing basics
Lab: Synthesize AXI-APB bridge, run STA, basic floorplan,
Synthesizable vs non-synthesizable constructs
Interfaces, modports, virtual interfaces
OOP in SV, constrained randomization
Coverage: functional & code
Assertions (SVA) basics
Lab: Layered testbench for FIFO in System Verilog (Use relevant tools, to deliver the module)
Goal: Build a UVM verification environment and complete a full design + verification cycle.
Testbench architecture, agent, sequencer, driver, monitor
Factory & configuration methods
Sequence items & stimulus generation
Scoreboarding & coverage closure
Register Abstraction Layer (RAL)
Lab: UVM environment for AXI-APB bridge or FIFO
Protocol controller (AXI-Stream to FIFO)
DSP accelerator (e.g., FIR filter)
Memory controller (SRAM/DDR interface, simplified)
Optional: Extend a small RISC-V core with a custom instruction Flow:
Frontend: RTL coding, linting, synthesis
Backend: STA (PrimeTime or equivalent), simple floorplan
Verification: UVM environment, functional & code coverage, assertions (Use relevant tools, to deliver the module)
Deliverables:
RTL & verification code in Git report
Synthesis scripts & reports
Coverage reports
Final documentation & presentation Optional Short Module – Processor Architecture (For students interested in CPU design; 1–1.5 weeks)
Basic 3/5-stage pipeline
Instruction decode, execute, memory, writeback
Hazards & forwarding
Integration with AMBA bus
Lab: Add a simple custom instruction to a small CPU core
Coverage closure strategies
Writing design & verification specifications Code review best practices
General Responsibilities for All Training Providers’ Consortium
Following responsibilities will apply:
Selection Process: Conduct open, merit-based admissions (with geographic inclusivity)
Quality Assurance: Follow national standards and international benchmarks for content and delivery.
Monitoring & Reporting: Submit weekly reports, maintain attendance logs, record feedback.
Facilities: Ensure access to well-furnished labs equipped with high specific workstations, EDA tools, internet, and technical support.
Assessment: Develop pre- and post-assessments, quizzes, capstone evaluations
Placement & Impact Tracking: Report employment stats post-training, maintain alumni database
Coordination with PIU: Attend review meetings, respond to compliance checks, facilitate audits.
All bidding consortiums are required to submit a complete proposal package comprising a Technical Proposal and a Financial Proposal in separate sealed envelopes (or folders if digital). The proposals must be clearly labeled and submitted by the deadline mentioned in the RFP. Incomplete proposals or those not meeting the format requirements will be rejected.
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The Technical Proposal must demonstrate the applicant’s understanding of the program, their technical capacity to deliver the training, and a clear roadmap for execution and outcomes. It should include the following sections:
Overview of the applying organizations/consortium
Legal status and relevant registrations (HEC, SECP, etc.)
Vision, mission, training expertise and relevance to semiconductor industry
Key personnel and their qualifications
Â
Summary of past experience in delivering similar technical or IC design training programs.
Evidence of R&D projects, industry collaborations, or semiconductor-related academic initiatives.
At least two (2) relevant training/project summaries (with outcomes).
Â
Training levels being applied for Level-1, with enhanced course curriculum spanned over 04 months and covered in max 500 hours.
Proposed curriculum and module outlines.
Weekly training schedule and structure (lab vs lecture hours)
Training methodology (hands-on, blended, flipped, etc.)
Certification plan (pre/post assessments, project review, exams)
Â
Detailed CVs with qualifications and semiconductor-specific experience.
Availability and commitment duration.
Â
Description of on-site or virtual lab facilities.
Availability or access plan for EDA tools.
Number of workstations, licenses, and usage plan.
Â
Letters of support or signed MoUs with companies for project collaboration and trainees’ placement.
Strategy for involving industry experts in mentorship or curriculum input.
Placement support model.
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Tools or systems for trainee tracking, attendance monitoring, and feedback collection.
Format of progress and performance reports.
Mechanism for evaluating program impact.
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Plan for sustaining and scaling the training beyond the current cycle.
Institutional commitment to integrate into regular offerings (if applicable).
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The Financial Proposal must present a transparent, detailed, and justifiable budget for the proposed training programs on per trainee basis. It should include:
Per trainee cost
The financial proposal shall include the cost of each element involved in the delivering the specified trainings like, Trainer and staff honoraria, Lab infrastructure and operational costs, Software/tools access or licensing, Utilities and overheads, Materials and printing, Monitoring and administration.
Cost estimates based on proposed batch size (maximum trainees per batch shall not exceed than 40).
Multiple batch scenarios (if applicable).
Payment Milestones
|
Sr. # |
Deliverables |
%age of Contract Amount |
|
1 |
Submission of :
|
15% |
|
2 |
Completion of 33% trainings hours |
20% |
|
3 |
Completion of 66% of training hours |
20% |
|
4 |
Completion of 100% training hours |
20% |
|
5 |
Post Training Assistance and 60% Job Placement
|
25% |
Note: Further the payment milestone will be finalized at the time of signing contract & as per the budget availability.
Only those proposals that meet the eligibility criteria and are deemed technically responsive (achieving the minimum qualifying score of 70% in the technical evaluation) will proceed to the financial evaluation stage.
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.Terms of Reference
The Successful Bidder (Training Provider) is expected to deliver the following services:
Comprehensive Program Delivery & Support
The training provider shall ensure uninterrupted delivery of the approved Upskilling Training Program, including:
|
27October202610:29:45AM |
Delivery Timeline
To ensure timely execution and alignment with the objectives of the National Semiconductor Human Resource Development Program (NSHRDP), the selected vendor is required to complete the entire delivery within the stipulated training program within timeline.
Training Delivery and Implementation Period
•   All approved training programs, including curriculum setup, trainer mobilization, lab readiness, and provisioning of required software tools, must be started within the agrÂ
The commissioning process for the Upskilling Training Program shall include:
Acceptance Testing
Final acceptance of the training program will be contingent upon:
Formal sign-off from the NSHRDP Technical Lead and Program Coordinator confirming readiness to commence full-scale training
Financial Evaluation (Total Weight: 20%)
Financial proposals will be evaluated for cost-efficiency and value-for-money separately for each
Lot.
Note: The lowest responsive bid in each Lot will receive full marks; others in that Lot will be
scored proportionally using a formula (e.g., [Lowest Bid Ă· Bidder's Cost] Ă— 20).
Final Selection
The final score will be calculated as follows:
ď‚· Technical Proposal: 80%
ď‚· Financial Proposal: 20%
ď‚· Total Maximum Score: 100 Points
Consortium Participation:
Participation in the subject RFP will be only through a consortium comprised entities complying
eligibility criteria. Consortiums may include academic institutions, training providers, and
industry partners, combining their expertise to deliver various aspects of the training program. A
formal consortium agreement outlining roles, responsibilities, must be submitted with the
proposal. The lead local partner will be solely accountable to the PIU for coordination, reporting,
and financial compliance.
Preparation of Proposal
8.1. Language of the Proposal
Proposals prepared by the Bidders and all correspondence and documents relating to the
Proposal exchanged between the Bidders and the Company shall be in writing and in English
Language.
8.2. Proposal Currency
All prices shall be quoted in Pakistan Rupees (PKR) and all payments will be made in
Pakistan Rupees (PKR.).
8.3. Period of Validity of Proposal
Proposals shall remain valid for 180 days from the last date of proposal submission as
provided in the RFP document. In exceptional circumstances, the procuring agency may
solicit the Bidder’s consent to an extension of the period of validity without any material
changes in the Bidding Document.
8.4. Supporting Documents
While preparing the Technical Proposal, the Bidder shall ensure that it provides the Company
with documentary evidence. Bid evaluation committees will evaluate Proposals solely on the
basis of documentary evidence submitted in accordance with evaluation criteria described in
this Bidding Document.
8.5. Cost of Preparing Proposal
All costs of preparing Proposal and of negotiating with Company, including visits for
discussion with Company, are the sole responsibility of the bidding consortium and not
reimbursable.
8.6. Proposal Documents
The Proposal, with serial number of each page should comprise the following:
Technical Proposal
Technical Proposal must consist of the following:
a) Checklist (Mandatory Documents required with the Proposal)
b) Technical Proposal Submission – Form B1
c) Firms/Bidders Profile – Form B2
d) Relevant Experience of the Firm/Bidder – Form B3
e) Qualification, Total Experience and professional Certification/Membership – Form B4-IÂ
Composition of Proposed Project Management Team with Organogram – Form B4-II
g) Details of Physical & ICT Infrastructure – Form B5-I
h) Inclusivity – Form B5-II
i) Training Methodology – Form B5-III Transfer of Knowledge – Form B5-IV Industry
Engagement / Support Letters – Form B5-V
Technical Proposal shall detail the capability and experience of delivering the services
specified in the ToR..
Team structure proposed by the Bidder for the project (including updated CVs of individuals
involved in management and project implementation) in accordance with relevant Forms.
Financial Proposal
Financial Proposal must consist of the following:
a) Financial Proposal Submission Form– Form C1
b) Summary of costs – Form C2
c) Format of Financial Bid – Form C3
Contact info for Queries
For any technical queries, following contact may please be approached:
1. Dr. Adil Masood
Director Curricullum-M&EÂ (NSHRDP) PSEB
Email: amasood@pseb.org.pk
2. Mr. Asif Bashir
Director Training & Placement
abalmani@pseb.org.pk
For general queries, please contact:
3. Mr. Rao Muhammad Arif Khan
Manager Procurement
Email: rarif@pseb.org.pk
Pakistan Software Export Board, 6th Floor New State life Building, Blue area, Islamabad
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For Individual Positions
| # | Position Title | Quantity | Unit Price (PKR) | Total Price (PKR) | Delivery Location | Delivery Period / Year | Country of Origin |
|---|---|---|---|---|---|---|---|
| 1 | |||||||
| 2 |
| # | Lot Title | Total Lot Price (PKR) | Country of Origin |
|---|---|---|---|
| 1 | [Lot 1 Title] |
The following Special Conditions of Contract shall supplement the General Conditions of Contract. Whenever there is a conflict, the provisions herein shall prevail over those in the Conditions of Contract. The corresponding clause number of the GCC is indicated in parentheses.
Number of GC Clause
Amendments of, and Supplements to, Clauses in the General Conditions of Contract
Definitions
The Procuring Agency is: Pakistan Software Export Board` (Pakistan Software Export Board), Project Director IFC BUILDING - Pakistan Software Export Board Second Floor 5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
Contractor is:
The title of the subject procurement is:PROCUREMENT OF SERVICES FOR UPSKILLING TRAINING PROGRAM (USTP) FOR THE PROJECT “NATIONAL SEMICONDUCTOR HUMAN RESOURCE DEVELOPMENT PROGRAM (NSHRDP) PHASE-I”
Number of GC Clause 2
Applicable/Governing Law:
The Contract shall be interpreted in accordance with the laws of Islamic Republic of Pakistan
Number of GC Clause 3
Language:
The language of the Contract, all correspondence and communications to be given, and all other documentation to be prepared and supplied under the Contract shall be in English.
Number of GC Clause 4
Notices:
The addresses for the notices are:
Procuring Agency:
Pakistan Software Export Board` (Pakistan Software Export Board), Project Director
IFC BUILDING - Pakistan Software Export Board Second Floor
5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
+92-313-228-5032
skashif@pseb.org.pk
Contractor/ Bidder:
[Name, address and telephone number].
The Contractor/ Bidder’s Representative(s)
[Name, address, telephone number and e-mail address]
Number of GC Clause 6.1
The Authorized Representatives are:
For the Procuring Agency:
Pakistan Software Export Board` (Pakistan Software Export Board), Project Director
IFC BUILDING - Pakistan Software Export Board Second Floor
5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
+92-313-228-5032
skashif@pseb.org.pk
For the Bidder:
Name: ………………………
Designation: ……………..
Address: ……………………………..
Number of GC Clause 7
Effectiveness of the contract
The Contractor/Bidder shall be effective within ….. days from the date of signature of the Contract by both parties
Number of GC Clause 8
Commencement of Contract:
The Contractor/ Bidder shall provide Non-Consultancy Services from the effective date of contract.
Number of GC Clause 10.2
Expiration of Contract:
The time period shall be ………………….
Number of GC Clause 14
Termination
In the event of termination of the contract due to any reason as already defined in the General Conditions of Contract, the Bidder shall be responsible for providing to the Authority the Goods till the time of alternate arrangements.
Number of GC Clause 16
Conflict of Interest:
The Procuring Agency reserves the right to determine on a case-by-case basis whether the Bidder should be disqualified from providing goods or services due to a conflict of a nature described in Clause GCC 16.
Number of GC Clause 20
Liquidated Damages
If the Bidder fails to provide services as required under the contract or in case of any data loss/data breach or any incident compromising the data security or other such failures related to any services, the Bidder shall pay to the Procuring Agency as Liquidated Damages at a rate of 0.03% to 2.00% of the Contract value, in accordance with the extent of performance failure & the cost of investigating such incidents as judged by the Authority.
Number of GC Clause 21
Performance Guarantee:
Instrument of Performance Guarantee shall be in the Name of : Pakistan Software Export Board`
The amount of performance guarantee shall be 5.00% of the contract price in acceptable form of Pay Order, Bank Guarantee
Number of GC Clause 27
Currency of Payment:
All the payment to be released to the contractor/Bidder shall be in Pakistani Rupees.
Number of GC Clause 28
Payment terms:
Payment will be made to the Bidder against the procured Goods and services according to the actual invoice or running bills submitted by the Bidder against the services provided within the time given in the conditions of the contract.
Number of GC Clause 29
Identifying Defects:
The Authority reserves the right at any time to inspect the premises of the provider to inspect the goods and monitor the goods being provided.
Number of GC Clause 31
Following is the guidance for Dispute Resolution
Notwithstanding any reference to the arbitration herein, the parties shall continue to perform their respective obligations under the Contract unless they otherwise agree that the Authority shall pay the Bidder any monies due to the Bidder.
Arbitrator’s fee:
The fee shall be specified in Pak Rupees, as determined by the Arbitrator, which shall be shared equally by both parties.
Appointing Authority for Arbitrator:
By the Mutual Consent or in accordance with the provisions of Arbitration Act, 1940, in case the parties fail to reach a consensus on the name of sole arbitrator, any party may submit an application to the Chief Justice Islamabad High Court for appointment of sole arbitrator. The Chief Justice IHC may appoint a former judge of any High Court or Supreme Court as the sole arbitrator to resolve the dispute between the parties.
Rules of procedure for arbitration proceedings:
Any dispute between the Authority and a Bidder who is a national of the Islamic Republic of Pakistan arising in connection with the present Contract shall be referred to adjudication or arbitration in accordance with the laws of the Islamic Republic of Pakistan including Arbitration Act 1940, however above provision shall prevail in referring the case to the Arbitrator.
Place of Arbitration and Award:
The arbitration shall be conducted in English language and place of arbitration shall be at Islamabad. The award of the arbitrator shall be final and shall be binding on the parties.
Date: [insert date (as day, month and year)]
Bid No.:P174105
To: Pakistan Software Export Board` (Pakistan Software Export Board), Project Director IFC BUILDING - Pakistan Software Export Board Second Floor 5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
We, the undersigned, declare that:
We understand that, according to your conditions, Bids must be supported by a Bid Securing Declaration.
We accept that we will be blacklisted and henceforth cross debarred for participating in respective category of public procurement proceedings for a period of (not more than) six months, if fail to abide with a bid securing declaration, however without indulging in corrupt and fraudulent practices, if we are in breach of our obligation(s) under the Bid conditions, because we:
We understand this Bid Securing Declaration shall expire if we are not the successful
Bidder, upon the earlier of (i) our receipt of your notification to us of the name of the successful Bidder; or (ii) twenty-eight (28) days after the expiration of our Bid.
THIS AGREEMENT made the _____ day of __________ 20_____ between Pakistan Software Export Board` (Pakistan Software Export Board), Project Director IFC BUILDING - Pakistan Software Export Board Second Floor 5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
(hereinafter called “the Procuring Agency”) of the one part and [name of Bidder] of [city and country of Bidder] (hereinafter called “the Bidder”) of the other part:
WHEREAS the Procuring Agency invited Bids for provision of goods, viz., PROCUREMENT OF SERVICES FOR UPSKILLING TRAINING PROGRAM (USTP) FOR THE PROJECT “NATIONAL SEMICONDUCTOR HUMAN RESOURCE DEVELOPMENT PROGRAM (NSHRDP) PHASE-I” (P174105) and has accepted a Bids by the Bidder for the provision of Services in the sum of [contract price in words and figures] (hereinafter called “the Contract Price”).
NOW THIS CONTRACT WITNESSETH AS FOLLOWS:
1. In this Contract words and expressions shall have the same meanings as are respectively assigned to them in the Conditions of Contract referred to.
2. The following documents shall be deemed to form and be read and construed as part of this Contract, In the event of any ambiguity or conflict between the Contract Documents listed below, the order of precedence shall be the order in which the Contract Documents are listed below:-
3. In consideration of the payments to be made by the Procuring Agency to the Bidder as hereinafter mentioned, the Bidder hereby covenants with the Procuring Agency to provide the Goods related services and to remedy defects therein in conformity in all respects with the provisions of the Contract.
4. The Procuring Agency hereby covenants to pay the Bidder in consideration of the provision of Goods and the remedying of defects therein, the Contract Price or such other sum as may become payable under the provisions of the contract at the times and in the manner prescribed by the contract.
IN WITNESS whereof the parties hereto have caused this Contract to be executed in accordance with their respective laws the day and year first above written.
Signed, sealed, delivered by __________________the ________________ (for the Procuring Agency)
Witness to the signatures of the Procuring Agency:
………………………………………………
Signed, sealed, delivered by __________________the ________________ (for the Procuring Agency)
Witness to the signatures of the Bidder: …………………………………………………
Contract Number: Contract Value: Contract Title:
Dated:
[Name of Supplier] hereby declares that it has not obtained or induced the procurement of any contract, right, interest, privilege or other obligation or benefit from Government of Pakistan or any administrative subdivision or agency thereof or any other entity owned or controlled by it (GoP) through any corrupt business practice.
Without limiting the generality of the foregoing [Name of Supplier] represents and warrants that it has fully declared the brokerage, commission, fee etc. paid or payable to anyone and not given or agreed to give and shall not give or agree to give to anyone within or outside Pakistan either directly or indirectly through any natural or juridical person, including its affiliate, agent, associate, broker, consultant, director, promoter, shareholder, sponsor or subsidiary, any commission, gratification, bribe, finder's fee or kickback, whether described as consultations fee or otherwise, with the object of obtaining or inducing the procurement of a contract, right, interest, privilege or other obligation or benefit in whatsoever form from GoP, except that which has been expressly declared pursuant hereto.
[Name of Supplier] certifies that it has made and will make full disclosure of all agreements and arrangements with all persons in respect of or related to the transaction with GoP and has not taken any action or will not take any action to circumvent the above declaration, representative or warranty.
[Name of Supplier] accepts full responsibility and strict liability for making and false declaration, not making full disclosure, misrepresenting fact or taking any action likely to defeat the purpose of this declaration, representation and warranty. It agrees that any contract, right interest, privilege or other obligation or benefit obtained or procured as aforesaid shall, without prejudice to any other right and remedies available to GoP under any law, contract or other instrument, be voidable at the option of GoP.
Notwithstanding any rights and remedies exercised by GoP in this regard, [Name of Supplier] agrees to indemnify GoP for any loss or damage incurred by it on account of its corrupt business practices and further pay compensation to GoP in an amount equivalent to ten time the sum of any commission, gratification, bribe, finder's fee or kickback given by [Name of Supplier] as aforesaid for the purpose of obtaining or inducing the procurement of any contract, right, interest, privilege or other obligation or benefit in whatsoever form from GoP.
To: Pakistan Software Export Board` (Pakistan Software Export Board), Project Director IFC BUILDING - Pakistan Software Export Board Second Floor 5-A Constitution Ave, F-5/1 F-5, Islamabad, 46000
WHEREAS [name of Bidder] (hereinafter called “the Bidder”) has undertaken, in pursuance of Contract No. [reference number of the contract] dated [insert date] for provision of Non-Consultancy Services(hereinafter called “the Contract”).
AND WHEREAS it has been stipulated by you in the said Contract that the Bidder shall furnish you with a Bank Guarantee by a reputable bank for the sum specified therein as security for compliance with the Bidder’s performance obligations in accordance with the Contract.
AND WHEREAS we have agreed to give the Bidders guarantee:
THEREFORE, WE hereby affirm that we are Guarantors and responsible to you, on behalf of the Bidder, up to a total of [amount of the guarantee in words and figures], and we undertake to pay you, upon your first written demand declaring the Bidder to be in default under the Contract and without cavil or argument, any sum or sums within the limits of [amount of guarantee] as aforesaid, without your needing to prove or to show grounds or reasons for your demand or the sum specified therein.
This guarantee is valid until the: [insert date]
Signature and seal of the Guarantors
_____________________________________________________________________
[name of bank or financial institution]
_____________________________________________________________________
[address]
_____________________________________________________________________
[date}